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Optimally assembled

"Back Side Reflow" for printed circuit boards

We have introduced a new system for the assembly of components on electronic printed circuit boards. Previous involved and partly inadequate soldering processes are now more efficient and the results in terms of quality are significantly better. Back Side Reflow provides the advantage that printed circuit boards with mixed components do not have to pass through many different process steps and several process lines any more but that only one assembly line is sufficient.

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